Key Takeaways
- Global semiconductor memory market revenue was $160.5 billion in 2022, growing 10.5% year-over-year due to strong demand for AI and data centers
- DRAM bit shipment grew by 22.8% YoY to 140.76 billion gigabits in Q4 2022, driven by server and PC demand recovery
- NAND flash revenue hit $17.7 billion in Q1 2023, up 3.8% QoQ amid enterprise SSD pull-ins
- Samsung's DRAM revenue share 42.7% in Q2 2023 at $10.3 billion total company memory
- SK Hynix held 28% DRAM market share in Q4 2023, revenue $7.5 billion
- Micron captured 23% DRAM share in Q2 2023, up from 19% prior quarter
- DRAM industry monthly capacity utilization 82% in Q2 2023
- NAND Flash wafer capacity grew 12.4% YoY to 1.2 million wafers/month in Q3 2023
- Samsung's Pyeongtaek fab expansion adds 120K DRAM wafers/month by end-2023
- Samsung pioneers 12-layer HBM2E stack production at 20Gbps/pin speeds 2023
- SK Hynix develops HBM3E at 9.6Gbps with 12-Hi 36GB capacity for AI 2024
- Micron 1-beta 1α DRAM node achieves 50% density gain over 1z at 24Gb DDR5 die 2023
- Global server DRAM demand 30% of total bits, 40% HBM by 2025
- NAND in smartphones accounts for 25% of total demand, 350 exabits annually 2023
- PC client SSD shipments 250 million units in 2023, up 5% YoY
Strong AI demand is driving major growth across all segments of the memory industry.
Applications and Demand
- Global server DRAM demand 30% of total bits, 40% HBM by 2025
- NAND in smartphones accounts for 25% of total demand, 350 exabits annually 2023
- PC client SSD shipments 250 million units in 2023, up 5% YoY
- Enterprise SSD capacity shipped 1.2 zettabytes in 2023, +20% YoY
- AI data center HBM demand 20,000 wafers in 2023, exploding to 120K in 2024
- Consumer SSDs represent 45% of NAND revenue in Q4 2023
- Automotive memory demand grows 20% YoY to 12 exabits bits in 2023
- Graphics card GDDR6 demand 15% of DRAM bits for gaming GPUs 2023
- Mobile DRAM in smartphones 4.8 billion chips shipped H1 2023
- Cloud hyperscalers consume 35% of enterprise NAND capacity 2023
- Industrial SSD shipments 45 million units in 2023, +12% YoY
- Surveillance storage NAND demand 50 exabits annually 2023
- Gaming console memory upgrade kits sell 5 million DDR5 units 2023
- Edge AI devices require 10% more LPDDR4X than prior gen 2023
- 5G base stations deploy 2 million UFS modules yearly 2023
- Data center CXL memory expansion kits 1 million sockets by end-2023
- Smart home devices NAND capacity average 128GB per unit 2023
- AR/VR headsets demand 16GB LPDDR5 per device ramping 2023
- Medical imaging SSDs use 40% enterprise-grade NAND for 10PB systems 2023
- Bitcoin mining rigs consume 5% of industrial DRAM supply 2023
- Hyperscale GPU clusters require 80% HBM per server node 2024
- Client PCs average 16GB DRAM installed base, upgrading to 32GB 20% YoY 2023
- NAND in EVs averages 1TB per vehicle for ADAS 2023
Applications and Demand Interpretation
Key Players and Market Share
- Samsung's DRAM revenue share 42.7% in Q2 2023 at $10.3 billion total company memory
- SK Hynix held 28% DRAM market share in Q4 2023, revenue $7.5 billion
- Micron captured 23% DRAM share in Q2 2023, up from 19% prior quarter
- Samsung NAND share 31.4% in Q1 2023, shipping 150 million wafers equivalent
- SK Hynix NAND market share 18.2% in Q3 2023, focusing on enterprise
- Micron NAND share 10.5% in Q2 2023, revenue $2.1 billion
- Kioxia-Yahoo joint venture holds 12% NAND share in 2023
- Western Digital NAND share 12.8% in Q4 2023, strong in client SSD
- Samsung controls 44% of HBM market in 2023, supplying Nvidia H100
- SK Hynix HBM3E share over 50% in Q2 2024 samples for Nvidia Blackwell
- Micron leads DDR5 module share at 35% in enterprise servers 2023
- Samsung smartphone UFS share 45% in Q3 2023
- SK Hynix server DRAM share 32% in Q3 2023
- YMTC (China) NAND share reached 5% in 2023, up from 2% in 2022
- Intel Optane (3D XPoint) share negligible post-discontinuation, <1% emerging memory
- Samsung Foundry memory integration 20% of its logic revenue in 2023
- SK Hynix acquired Intel NAND business for $9B, boosting share to 20%+ in 2023
- Micron solid-state drive controller share 25% in enterprise PCIe Gen5
- Kioxia BiCS8 3D NAND used in 15% of enterprise SSDs in 2023
- Samsung V-NAND share in QLC 40% in client SSD market 2023
- SK Hynix 4th-gen 10nm DRAM share 15% ramping in Q4 2023
- Micron 1-beta DRAM node yields over 70% in 2023 fabs
- Global DRAM production capacity led by Samsung at 45% in Q3 2023
- NAND foundry services by Samsung 10% of total NAND output in 2023
- SK Hynix plans 17 new fabs by 2030, targeting 40% DRAM share
- Samsung monthly DRAM output 300K wafers in Pyeongtaek fab HBM line 2023
- Global DRAM capacity 25.5 million wafers/month in Q4 2023, Samsung 42%
- Samsung 176-layer V-NAND production at 20% of total NAND bits in Q2 2023
Key Players and Market Share Interpretation
Market Size and Growth
- Global semiconductor memory market revenue was $160.5 billion in 2022, growing 10.5% year-over-year due to strong demand for AI and data centers
- DRAM bit shipment grew by 22.8% YoY to 140.76 billion gigabits in Q4 2022, driven by server and PC demand recovery
- NAND flash revenue hit $17.7 billion in Q1 2023, up 3.8% QoQ amid enterprise SSD pull-ins
- Worldwide DRAM market is projected to reach $113 billion by 2028, with a CAGR of 12.3% from 2023, fueled by HBM for AI GPUs
- NAND Flash market size stood at $65.4 billion in 2022 and expected to grow to $92.1 billion by 2030 at 4.4% CAGR
- Server DRAM revenue increased 28% YoY to $6.8 billion in Q3 2023, accounting for 30% of total DRAM market
- Global memory module market revenue reached $45.2 billion in 2023, up 15% from 2022 due to DDR5 adoption
- HBM revenue surged 280% YoY to $500 million in Q2 2023, representing 2% of DRAM total
- Consumer SSD revenue grew 12% QoQ to $4.1 billion in Q2 2023, boosted by seasonal PC demand
- Enterprise SSD market revenue was $8.9 billion in 2022, projected to grow at 15.2% CAGR to 2030
- DRAM contract prices rose 5-10% in Q4 2023 for DDR4 and DDR5 amid tight supply
- Global memory IC market capex is forecasted at $32 billion in 2024, up 20% YoY for capacity expansion
- NAND wafer fab utilization rate hit 85% in Q3 2023, supporting revenue growth to $18.2 billion
- Mobile DRAM revenue reached $4.5 billion in Q2 2023, flat QoQ but up 20% YoY
- Overall memory market ASP increased 8% in 2023 due to DDR5 transition and HBM demand
- Graphics DRAM revenue grew 40% YoY to $1.2 billion in Q3 2023, driven by GPU shipments
- Emerging memory market (MRAM, ReRAM) valued at $4.2 billion in 2023, CAGR 55% to 2030
- DRAM revenue for AI servers exploded 400% YoY in H1 2024 estimates
- NAND flash bit growth projected at 54% in 2024 to 1,439 eb
- Memory subsystem market to hit $150 billion by 2027, CAGR 11%
- QLED TV memory demand pushed panel-related DRAM to $800 million in 2023
- Automotive memory market revenue $5.6 billion in 2023, 18% CAGR to 2030
- Industrial NAND revenue up 25% to $2.1 billion in 2023
- PC client DRAM bit shipment +18% YoY in Q4 2023
- Total DRAM revenue $26.5 billion in Q4 2023, +10% QoQ
- NAND revenue $19.8 billion in Q4 2023, up 5% QoQ
- Memory card market $7.2 billion in 2023, declining 2% YoY
- eMMC/UFS revenue for smartphones $3.9 billion in H1 2023
- Hyperscale cloud DRAM spend $12 billion annually in 2023
- Memory market recovery led to 25% revenue growth in 2023 overall
Market Size and Growth Interpretation
Production and Capacity
- DRAM industry monthly capacity utilization 82% in Q2 2023
- NAND Flash wafer capacity grew 12.4% YoY to 1.2 million wafers/month in Q3 2023
- Samsung's Pyeongtaek fab expansion adds 120K DRAM wafers/month by end-2023
- SK Hynix HBM production capacity triples to 10K wafers/month in Q4 2023
- Global 3D NAND layer average 173 layers in Q3 2023, up from 140 in prior year
- Micron Xi'an fab (China) produces 40K DRAM wafers/month, 15% of company total
- NAND bit production growth 42% YoY in 2023 to 760 exabits
- DRAM fab utilization peaks at 90% for server-grade in Q3 2023
- Kioxia Yokkaichi fab output 50K NAND wafers/month post-expansion 2023
- Western Digital/SanDisk Fab4 in Malaysia adds 30K 3D NAND wafers/month
- YMTC Wuhan fab reaches 20K wafers/month on 232-layer NAND in 2023
- Global HBM capacity 50K wafers/year in 2023, scaling to 200K by 2025
- DDR5 DRAM production ramp to 25% of total DRAM bits by end-2023
- NAND QLC bit share in production 18% in Q4 2023, up from 10% prior year
- SK Hynix Cheongju fab idle capacity reactivated 20K wafers for HBM2E
- Samsung Hwaseong cluster produces 250K DRAM wafers/month total 2023
- Global memory capex $30.5 billion in 2023, 70% for NAND equipment
- 3D NAND die stacking layers average 200+ in leading-edge production Q1 2024
- DRAM 1z-nm class output 60% of total capacity in Q4 2023
- NAND wafer starts up 15% QoQ in Q4 2023 to support 2024 growth
- Fab equipment spend for memory $18 billion in 2024 forecast
- LPDDR5X production yields exceed 80% at Samsung for premium smartphones 2023
- DDR5-6400 modules mass production starts at 10K units/month per major vendor Q4 2023
- HBM3E wafers qualified at 12-Hi stacks with 36GB capacity per stack 2024
- Global 10nm-class DRAM capacity utilization 88% in server segment Q3 2023
- DDR5 transition reaches 15% of server DIMM sockets in Q4 2023 deployments
Production and Capacity Interpretation
Technology and Innovation
- Samsung pioneers 12-layer HBM2E stack production at 20Gbps/pin speeds 2023
- SK Hynix develops HBM3E at 9.6Gbps with 12-Hi 36GB capacity for AI 2024
- Micron 1-beta 1α DRAM node achieves 50% density gain over 1z at 24Gb DDR5 die 2023
- Samsung V9 3D V-NAND at 290+ layers with Cu-AI wiring for 30% performance boost 2024
- SK Hynix 4th-gen 10nm DDR5 DRAM reduces power 20% at 5600Mbps speeds 2023
- YMTC Xtacking 3.0 architecture enables 232-layer NAND with 40% throughput gain 2023
- Kioxia BiCS8 218-layer NAND achieves 1.6Tb QLC dies for 30TB SSDs 2023
- Micron 232-layer 3D NAND with 2.7Gb/mm² density, 50% higher than prior gen 2023
- Intel 18A process integrates compute-express link for CXL memory pooling 2024
- Samsung GDDR7 at 32Gbps announced, 60% faster than GDDR6X for AI GPUs 2024
- SK Hynix LPDDR5T at 9.6Gbps for automotive, 33% power reduction 2023
- Western Digital PLC-SLC caching boosts SSD endurance 4x in BiCS6 2023
- Everspin 1Gb DDR MRAM at 700MB/s speeds samples 2023 for edge AI
- Samsung Z-NAND flash 50% latency reduction vs DRAM for embedded 2023
- SK Hynix HBM-PIM integrates compute for 4x AI inference speedup 2024
- Micron GDDR6X at 24Gbps with 2GB dies for RTX 5090 prototypes 2024
- Kioxia 3D-IGZO TFT for over 10,000 layer NAND stacking feasibility 2024
- YMTC 128-layer QLC NAND with 20Gb/s interface for enterprise 2023
- Samsung 14nm EUV DRAM for HBM4 development at 50% higher density 2025
- SK Hynix 12th-gen V-NAND at 238 layers with 7th-gen charge trap 2023
- Micron UFS 4.1 at 5.8GB/s for next-gen smartphones 2024
Technology and Innovation Interpretation
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